Features :
● Maximum current capability up to 3~5 A.
● Low DC resistance.
● Impedance up to 700 Ω.
● Special NiSn pad for improved soldering results.
● Storage temperature: -40℃--125℃.
● Operating temperature: -40℃--125℃(temperature rise included).
Applications :
● Protection against radio frequency interferences of components
on PCB’s
DD
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